टाँका

६०-४० सोल्डर का तार

टाँका या सोल्डर (Solder) एक गलनीय मिश्रधातु है। इसका उपयोग टाँका लगाने तथा धातु के टुकड़ों को जोड़ने के काम आती है।

विभिन्न प्रकार के सोल्डर

संरचना	गलनांक °C S/L	विषैलापन	गलनक्रांतिक	टिप्पणी	Sn	Pb	Ag	Cu	Sb	Bi	In	Zn	Cd	Au	अन्य.
Sn50Zn49Cu1	200/300		no	Galvanite Lead free galvanizing solder formulation designed specifically for high quality repairs to galvanized Steel surfaces. Simple, effective and easy to use, in both manufacturing and field applications. Metallurgically bonds to the Steel, for a seamless protective barrier.	50			1				49
Sn90Zn7Cu3	200/222		no	Kapp Eco-Babbitt Commonly used in capacitor manufacturing as protective coating to shield against electromotive force (EMF) and electromagnetic interference (EMI) with the specified performance of the capacitor, to prevent current and charge leakage out of and within the layers of the capacitor, and to prevent the development of electron flows within the coating material itself, that would dimminish capacitor performance, coating, and capacitor life.	90			3				7
Pb90Sn10	268/302 275/302	Pb	no	Sn10, UNS L54520, ASTM10B. Balls for CBGA components, replaced by Sn95.5Ag3.9Cu0.6. Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those. Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder. Has low thermal EMF, can be used as an alternative to Cd70 where parasitic thermocouple voltage has to be avoided.	10	90
Pb88Sn12	254/296	Pb	no	Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder.	12	88
Pb85Sn15	227/288	Pb	no	Used for coating tubes and sheets and fabrication of car radiators. Body solder.	15	85
Pb80Sn20	183/280	Pb	no	Sn20, UNS L54711. Used for coating radiator tubes for joining fins.	20	80
Pb75Sn25	183/266	Pb	no	Crude solder for construction plumbing works, flame-melted. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.	25	75
Pb70Sn30	185/255 183/257	Pb	no	Sn30, UNS L54280, crude solder for construction plumbing works, flame-melted, good for machine and torch soldering. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.	30	70
Pb68Sn32	253	Pb	no	"Plumber solder", for construction plumbing works	32	68
Pb68Sn30Sb2	185/243	Pb	no	Pb68	30	68			2
Sn30Pb50Zn20	177/288	Pb	no	Kapp GalvRepair Economical solder for repairing & joining most metals including Aluminum and cast Iron. Have been the used for cast Iron and galvanized surface repair.	30	50						20
Sn33Pb40Zn28	230/275	Pb	no	Economical solder for repairing & joining most metals including Aluminum and cast Iron. Have been the used for cast Iron and galvanized surface repair.	33	40						28
Pb67Sn33	187–230	Pb	no	PM 33, crude solder for construction plumbing works, flame-melted, temperature depends on additives	33	67
Pb65Sn35	183/250	Pb	no	Sn35. Used as a cheaper alternative of Sn60Pb40 for wiping and sweating joints.	35	65
Pb60Sn40	183/238 183/247	Pb	no	Sn40, UNS L54915. For soldering of brass and car radiators. For bulk soldering, and where wider melting point range is desired. For joining cables. For wiping and joining lead pipes. For repairs of radiators and electrical systems.	40	60
Pb55Sn45	183/227	Pb	no	For soldering radiator cores, roof seams, and for decorative joints.	45	55
Sn50Pb50	183/216 183–212	Pb	no	Sn50, UNS L55030. "Ordinary solder", for soldering of brass, electricity meters, gas meters, formerly also tin cans. General purpose, for standard tinning and sheetmetal work. Becomes brittle below −150 °C. Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those. For wiping and assembling plumbing joints for non-potable water.	50	50
Sn50Pb48.5Cu1.5	183/215	Pb	no	Savbit, Savbit 1, Sav1. Minimizes dissolution of copper. Originally designed to reduce erosion of the soldering iron tips. About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires.	50	48.5		1.5
Sn60Pb40	183/190 183/188	Pb	near	Sn60, ASTM60A, ASTM60B. Common in electronics, most popular leaded alloy for dipping. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those. Slightly cheaper than Sn63Pb37, often used instead for cost reasons as the melting point difference is insignificant in practice. On slow cooling gives slightly duller joints than Sn63Pb37.	60	40
Sn60Pb38Cu2	183/190	Pb		Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder.	60	38		2
Sn60Pb39Cu1		Pb	no		60	39		1
Sn62Pb38	183	Pb	near	"Tinman's solder", used for tinplate fabrication work.	62	38
Sn63Pb37	183	Pb	yes	Sn63, ASTM63A, ASTM63B. Common in electronics; exceptional tinning and wetting properties, also good for stainless steel. One of most common solders. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those. Sn60Pb40 is slightly cheaper and is often used instead for cost reasons, as the melting point difference is insignificant in practice. On slow cooling gives slightly brighter joints than Sn60Pb40.	63	37
Sn63Pb37P0.0015–0.04	183	Pb	yes	Sn63PbP. A special alloy for HASL machines. Addition of phosphorus reduces oxidation. Unsuitable for wave soldering as it may form metal foam.	63	37									P
Sn62Pb37Cu1	183	Pb	yes	Similar to Sn63Pb37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder.	62	37		1
Sn70Pb30	183/193	Pb	no	Sn70	70	30
Sn90Pb10	183/213	Pb	no	formerly used for joints in food industry	90	10
Sn95Pb5	238	Pb	no	plumbing and heating	95	5
Pb92Sn5.5Ag2.5	286/301	Pb	no	For higher-temperature applications.	5.5	92	2.5
Pb80Sn12Sb8		Pb	no	Used for soldering iron and steel	12	80			8
Pb80Sn18Ag2	252/260	Pb	no	Used for soldering iron and steel	18	80	2
Pb79Sn20Sb1	184/270	Pb	no	Sb1	20	79			1
Pb55Sn43.5Sb1.5		Pb	no	General purpose solder. Antimony content improves mechanical properties but causes brittleness when soldering cadmium, zinc, or galvanized metals.	43.5	55			1.5
Sn43Pb43Bi14	144/163	Pb	no	Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. Useful for step soldering.	43	43				14
Sn46Pb46Bi8	120/167	Pb	no	Bi8	46	46				8
Bi52Pb32Sn16	96	Pb	yes?	Bi52. Good fatigue resistance combined with low melting point. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.	16	32				52
Bi46Sn34Pb20	100/105	Pb	no	Bi46	34	20				46
Sn62Pb36Ag2	179	Pb	yes	Sn62. Common in electronics. The strongest tin-lead solder. Appearance identical to Sn60Pb40 or Sn63Pb37. Crystals of Ag3Sn may be seen growing from the solder. Extended heat treatment leads to formation of crystals of binary alloys. Silver content decreases solubility of silver, making the alloy suitable for soldering silver-metallized surfaces, e.g. SMD capacitors and other silver-metallized ceramics. Not recommended for gold. General-purpose.	62	36	2
Sn62.5Pb36Ag2.5	179	Pb	yes		62.5	36	2.5
Pb88Sn10Ag2	268/290 267/299	Pb	no	Sn10, Pb88. Silver content reduces solubility of silver coatings in the solder. Not recommended for gold. Forms a eutectic phase, not recommended for operation above 120 °C.	10	88	2
Pb90Sn5Ag5	292	Pb	yes		5	90	5
Pb92.5Sn5Ag2.5	287/296 299/304	Pb	no	Pb93.	5	92.5	2.5
Pb93.5Sn5Ag1.5	296/301 305/306	Pb	no	Pb94, HMP alloy, HMP. Service temperatures up to 255 °C. Useful for step soldering. Also can be used for extremely low temperatures as it remains ductile down to −200 °C, while solders with more than 20% tin become brittle below −70 °C. Higher strength and better wetting than Pb95Sn5.	5	93.5	1.5
Pb95.5Sn2Ag2.5	299/304	Pb	no		2	95.5	2.5
In97Ag3	143	–	yes	Wettability and low-temperature malleability of indium, strength improved by addition of silver. Particularly good for cryogenic applications. Used for packaging of photonic devices.			3				97
In90Ag10	143/237	–	no	Nearly as wettable and low-temperature malleable as indium. Large plastic range. Can solder silver, fired glass and ceramics.			10				90
In75Pb25	156/165	Pb	no	Less gold dissolution and more ductile than lead-tin alloys. Used for die attachment, general circuit assembly and packaging closures.		25					75
In70Pb30	160/174 165/175	Pb	no	In70. Suitable for gold, low gold-leaching. Good thermal fatigue properties.		30					70
In60Pb40	174/185 173/181	Pb	no	In60. Low gold-leaching. Good thermal fatigue properties.		40					60
In50Pb50	180/209 178/210	Pb	no	In50. Only one phase. Resoldering with lead-tin solder forms indium-tin and indium-lead phases and leads to formation of cracks between the phases, joint weakening and failure. On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic. Less gold dissolution and more ductile than lead-tin alloys. Good thermal fatigue properties.		50					50
In50Sn50	118/125	–	no	Cerroseal 35. Fairly well wets glass, quartz and many ceramics. Malleable, can compensate some thermal expansion differences. Low vapor pressure. Used in low temperature physics as a glass-wetting solder.	50						50
In70Sn15Pb9.6Cd5.4	125	Pb,Cd			15	9.6					70		5.4
Pb75In25	250/264 240/260	Pb	no	In25. Low gold-leaching. Good thermal fatigue properties. Used for die attachment of e.g. GaAs dies. Used also for general circuit assembly and packaging closures. Less dissolution of gold and more ductile than tin-lead alloy.		75					25
Sn70Pb18In12	162 154/167	Pb	yes	General purpose. Good physical properties.	70	18					12
Sn37.5Pb37.5In25	134/181	Pb	no	Good wettability. Not recommended for gold.	37.5	37.5					25
Pb90In5Ag5	290/310	Pb	no			90	5				5
Pb92.5In5Ag2.5	300/310	Pb	no	UNS L51510. Minimal leaching of gold, good thermal fatigue properties. Reducing atmosphere frequently used..		92.5	2.5				5
Pb92.5In5Au2.5	300/310	Pb	no	In5		92.5					5			2.5
Pb94.5Ag5.5	305/364 304/343	Pb	no	Ag5.5, UNS L50180		94.5	5.5
Pb95Ag5	305/364	Pb	no			95	5
Pb97.5Ag2.5	303 304 304/579	Pb	yes no	Ag2.5, UNS L50132. Used during World War II to conserve tin. Poor corrosion resistance; joints suffered corrosion in both atmospheric and underground conditions, all had to be replaced with Sn-Pb alloy joints. Torch solder.		97.5	2.5
Sn97.5Pb1Ag1.5	305	Pb	yes	Important for hybrid circuits assembly.	97.5	1	1.5
Pb97.5Ag1.5Sn1	309	Pb	yes	Ag1.5, ASTM1.5S. High melting point, used for commutators, armatures, and initial solder joints where remelting when working on nearby joints is undesirable. Silver content reduces solubility of silver coatings in molten solder. Not recommended for gold. Standard PbAgSn eutectic solder, wide use in semiconductor assembly. Reducing protective atmosphere (e.g. 12% hydrogen) often used. High creep resistance, for use at both elevated and cryogenic temperatures.	1	97.5	1.5
Pb54Sn45Ag1	177–210	Pb		exceptional strength, silver gives it a bright long-lasting finish; ideal for stainless steel	45	54	1
Pb96Ag4	305	Pb		high-temperature joints		96	4
Pb96Sn2Ag2	252/295	Pb		Pb96	2	96	2
Sn61Pb36Ag3		Pb			61	36	3
Sn56Pb39Ag5		Pb			56	39	5
Sn98Ag2		–			98		2
Sn65Ag25Sb10	233	–	yes	Very high tensile strength. For die attachment. Very brittle. Old Motorola die attach solder.	65		25		10
Sn96.5Ag3.0Cu0.5	217/220 217/218	–	near	SAC305. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn97Ag3 alloy. Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.	96.5		3	0.5
Sn95.8Ag3.5Cu0.7	217–218	–	near	SN96C-Ag3.5 A commonly used alloy. Used for wave soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn96.5Ag3.5 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.	95.8		3.5	0.7
Sn95.6Ag3.5Cu0.9	217	–	yes	Determined by NIST to be truly eutectic.	95.6		3.5	0.9
Sn95.5Ag3.8Cu0.7	217	–	almost	SN96C. Preferred by the European IDEALS consortium for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.	95.5		3.8	0.7
Sn95.25Ag3.8Cu0.7Sb0.25		–		Preferred by the European IDEALS consortium for wave soldering.	95.25		3.8	0.7	0.25
Sn95.5Ag3.9Cu0.6	217	–	yes	Recommended by the US NEMI consortium for reflow soldering. Used as balls for BGA/CSP and CBGA components, a replacement for Sn10Pb90. Solder paste for rework of BGA boards. Alloy of choice for general SMT assembly.	95.5		3.9	0.6
Sn95.5Ag4Cu0.5	217	–	yes	Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications.	95.5		4	0.5
Sn96.5Ag3.5	221	–	yes	Sn96, Sn96.5, 96S. Fine lamellar structure of densely distributed Ag3Sn. Annealing at 125 °C coarsens the structure and softens the solder. Creeps via dislocation climb as a result of lattice diffusion. Used as wire for hand soldering rework; compatible with SnCu0.7, SnAg3Cu0.5, SnAg3.9Cu0.6, and similar alloys. Used as solder spheres for BGA/CSP components. Used for step soldering and die attachment in high power devices. Established history in the industry. Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. Marginal wetting. Good for step soldering. Used for soldering stainless steel as it wets stainless steel better than other soft solders. Silver content does not suppress dissolution of silver metallizations. High tin content allows absorbing significant amount of gold without embrittlement.	96.5		3.5
Sn96Ag4	221–229	–	no	ASTM96TS. "Silver-bearing solder". Food service equipment, refrigeration, heating, air conditioning, plumbing. Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.	96		4
Sn95Ag5	221/254	–	no	Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 30,000 psi on Stainless.	95		5
Sn94Ag6	221/279	–	no	Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 30,000 psi on Stainless.	94		6
Sn93Ag7	221/302	–	no	Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 31,000 psi on Stainless. Audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance.	93		7
Sn95Ag4Cu1		–			95		4	1
Sn	232	–	pure	Sn99. Good strength, non-dulling. Use in food processing equipment, wire tinning, and alloying. Susceptible to tin pest.	99.99
Sn99.3Cu0.7	227	–	yes	Sn99Cu1. Also designated as Sn99Cu1. Cheap alternative for wave soldering, recommended by the US NEMI consortium. Coarse microstructure with ductile fractures. Sparsely distributed Cu6Sn5. Forms large dendritic ß-tin crystals in a network of eutectic microstructure with finely dispersed Cu6Sn5. High melting point unfavorable for SMT use. Low strength, high ductility. Susceptible to tin pest. Addition of small amount of nickel increases its fluidity; the highest increase occurs at 0.06% Ni. Such alloys are known as nickel modified or nickel stabilized.	99.3			0.7							(Ni)
Sn99Cu0.7Ag0.3	217/228	–	no	SCA, SAC, or SnAgCu. Tin-silver-copper alloy. Relatively low-cost lead-free alloy for simple applications. Can be used for wave, selective and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.	99		0.3	0.7
Sn97Cu3	227/250 232/332	–		For high-temperature uses. Allows removing insulation from an enameled wire and applying solder coating in a single operation. For radiator repairs, stained glass windows, and potable water plumbing.	97			3
Sn97Cu2.75Ag0.25	228/314	–		High hardness, creep-resistant. For radiators, stained glass windows, and potable water plumbing. Excellent high-strength solder for radiator repairs. Wide range of patina and colors.	97		0.25	2.75
Zn100	419	–	pure	For soldering aluminium. Good wettability of aluminium, relatively good corrosion resistance.								100
Bi100	271	–	pure	Used as a non-superconducting solder in low-temperature physics. Does not wet metals well, forms a mechanically weak joint.						100
Sn91Zn9	199	–	yes	KappAloy9 Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Best solder for Aluminum wire to Copper busses or Copper wire to Aluminum busses or contacts. UNS#: L91090	91							9
Sn85Zn15	199/260	–	no	KappAloy15 Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Has a wide plastic range this makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools.	85							15
Zn95Al5	382	–	yes	For soldering aluminium. Good wetting.								95			Al5
Sn91.8Bi4.8Ag3.4	211/213	–	no	Do not use on lead-containing metallizations. U.S. Patent 5,439,639 (ICA Licensed Sandia Patent).	91.8		3.4			4.8
Sn70Zn30	199/316	–	no	KappAloy30 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn.	70							30
Sn80Zn20	199/288	–	no	KappAloy20 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn.	80							20
Sn60Zn40	199/343	–	no	KappAloy40 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn.	60							40
Pb63Sn35Sb2	185/243	Pb	no	Sb2	35	63			2
Pb63Sn34Zn3	170/256	Pb	no	Poor wetting of aluminium. Poor corrosion rating.	34	63						3
Pb92Cd8	310?	Pb,Cd	?	For soldering aluminium. US patent 1,333,666.		92							8
Sn48Bi32Pb20	140/160	Pb	no	For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting.	48	20				32
Sn89Zn8Bi3	191–198	–		Prone to corrosion and oxidation due to its zinc content. On copper surfaces forms a brittle Cu-Zn intermetallic layer, reducing the fatigue resistance of the joint; nickel plating of copper inhibits this.	89					3		8
Sn83.6Zn7.6In8.8	181/187	–	no	High dross due to zinc. Covered by U.S. Patent #5,242,658.	83.6						8.8	7.6
Sn86.5Zn5.5In4.5Bi3.5	174/186	–	no	Lead-free. Corrosion concerns and high drossing due to zinc content.	86.5					3.5	4.5	5.5
Sn86.9In10Ag3.1	204/205	–		Potential use in flip-chip assembly, no issues with tin-indium eutectic phase.	86.9		3.1				10
Sn95Ag3.5Zn1Cu0.5	221L	–	no		95		3.5	0.5				1
Sn95Sb5	235/240 232/240	–	no	Sb5, ASTM95TA. The US plumbing industry standard. It displays good resistance to thermal fatigue and good shear strength. Forms coarse dendrites of tin-rich solid solution with SbSn intermetallic dispersed between. Very high room-temperature ductility. Creeps via viscous glide of dislocations by pipe diffusion. More creep-resistant than SnAg3.5. Antimony can be toxic. Used for sealing chip packagings, attaching I/O pins to ceramic substrates, and die attachment; a possible lower-temperature replacement of AuSn. High strength and bright finish. Use in air conditioning, refrigeration, some food containers, and high-temperature applications. Good wettability, good long-term shear strength at 100 °C. Suitable for potable water systems. Used for stained glass, plumbing, and radiator repairs.	95				5
Sn97Sb3	232/238	–	no		97				3
Sn99Sb1	232/235	–	no		99				1
Sn99Ag0.3Cu0.7		–			99		0.3	0.7
Sn96.2Ag2.5Cu0.8Sb0.5	217–225 217	–		Ag03A. Patented by AIM alliance.	96.2		2.5	0.8	0.5
Sn88In8.0Ag3.5Bi0.5	197–208	–		Patented by Matsushita/Panasonic.	88		3.5			0.5	8
Bi57Sn42Ag1	137/139 139/140	–		Addition of silver improves mechanical strength. Established history of use. Good thermal fatigue performance. Patented by Motorola.	42		1			57
Bi58Sn42	138	–	yes	Bi58. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. Low-temperature eutectic solder with high strength. Particularly strong, very brittle. Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature was required. Can be used as a coating of copper particles to facilitate their bonding under pressure/heat and creating a conductive metallurgical joint. Sensitive to shear rate. Good for electronics. Used in thermoelectric applications. Good thermal fatigue performance. Established history of use. Expands slightly on casting, then undergoes very low further shrinkage or expansion, unlike many other low-temperature alloys which continue changing dimensions for some hours after solidification.	42					58
Bi58Pb42	124/126	Pb				42				58
In80Pb15Ag5	142/149 149/154	Pb	no	In80. Compatible with gold, minimum gold-leaching. Resistant to thermal fatigue. Can be used in step soldering.		15	5				80
Pb60In40	195/225	Pb	no	In40. Low gold-leaching. Good thermal fatigue properties.		60					40
Pb70In30	245/260	Pb	no	In30		70					30
Sn37.5Pb37.5In26	134/181	Pb	no	In26	37.5	37.5					26
Sn54Pb26In20	130/154 140/152	Pb	no	In20	54	26					20
Pb81In19	270/280 260/275	Pb	no	In19. Low gold-leaching. Good thermal fatigue properties.		81					19
In52Sn48	118	–	yes	In52. Suitable for the cases where low-temperature soldering is needed. Can be used for glass sealing. Sharp melting point. Good wettability of glass, quartz, and many ceramics. Good low-temperature malleability, can compensate for different thermal expansion coefficients of joined materials.	48						52
Sn52In48	118/131	–	no	very low tensile strength	52						48
Sn58In42	118/145	–	no		58						42
Sn51.2Pb30.6Cd18.2	145	Pb,Cd	yes	General-purpose. Maintains creep strength well. Unsuitable for gold.	51.2	30.6							18.2
Sn77.2In20Ag2.8	175/187	–	no	Similar mechanical properties with Sn63Pb37, Sn62Pb36Ag2 and Sn60Pb40, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C.	77.2		2.8				20
In74Cd26	123	Cd	yes								74		26
In61.7Bi30.8Cd7.5	62	Cd	yes							30.8	61.7		7.5
Bi47.5Pb25.4Sn12.6Cd9.5In5	57/65	Pb,Cd	no		12.6	25.4				47.5	5		9.5
Bi48Pb25.4Sn12.8Cd9.6In4	61/65	Pb,Cd	no		12.8	25.4				48			9.6
Bi49Pb18Sn15In18	58/69	Pb	no		15	18				49	18
Bi49Pb18Sn12In21	58	Pb	yes	Cerrolow 136. Slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics.	12	18				49	21
Bi50.5Pb27.8Sn12.4Cd9.3	70/73	Pb,Cd	no		12.4	27.8				50.5			9.3
Bi50Pb26.7Sn13.3Cd10	70	Pb,Cd	yes	Cerrobend. Used in low-temperature physics as a solder.	13.3	26.7				50			10
Bi44.7Pb22.6In19.1Cd5.3Sn8.3	47	Cd,Pb	yes	Cerrolow 117. Used as a solder in low-temperature physics.	8.3	22.6				44.7	19.1		5.3
In60Sn40	113/122	–	no		40						60
In51.0Bi32.5Sn16.5	60.5	–	yes	Field's metal	16.5					32.5	51
Bi49.5Pb27.3Sn13.1Cd10.1	70.9	Pb,Cd	yes	Lipowitz Metal	13.1	27.3				49.5			10.1
Bi50.0Pb25.0Sn12.5Cd12.5	71	Pb,Cd	yes	Wood's metal, mostly used for casting.	12.5	25				50			12.5
Bi50.0Pb31.2Sn18.8	97	Pb	no	Newton's metal	18.8	31.2				50
Bi50Pb28Sn22	109	Pb	no	Rose's metal. It was used to secure cast iron railings and balusters in pockets in stone bases and steps. Does not contract on cooling.	22	28				50
Cd95Ag5	338/393	Cd	no	KappTec General purpose solder that will join all solderable metals except Aluminum. High temperature, high strength solder. It is used in applications where alloys melting higher than soft solders are required, but the cost and strength of Silver-brazing alloys is not necessary.			5						95
Cd82.5Zn17.5	265	Cd	yes	Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Also for soldering aluminium and die-cast zinc alloys. Used in cryogenic physics for ataching electrical potential leads to specimens of metals, as this alloy does not become superconductive at liquid helium temperatures.								17.5	82.5
Cd70Zn30	265/300	Cd	no	Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products.								30	70
Cd60Zn40	265/316	Cd	no	Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products.								40	60
Cd78Zn17Ag5	249/316	Cd	no	KappTecZ High temperature, high strength solder that may be used on most metals, but works extremely well on Aluminum, Copper and Stainless Steel. It has a high tolerance to vibration and stress, and good elongation for use on dissimilar metals. Above its liquidus of 600°F, this solder is extremely fluid and will penetrate the closest joints.			5					17	78
Sn40Zn27Cd33	176/260	Cd	no	KappRad Developed specifically to join and repair Aluminum and Aluminum/Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier.	40							27	33
Zn90Cd10	265/399	Cd		For soldering aluminium. Good wetting.								90	10
Zn60Cd40	265/335	Cd		For soldering aluminium. Very good wetting.								60	40
Cd70Sn30	140/160	Cd	no	Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics.	29.56								70.44
Sn50Pb32Cd18	145	Cd,Pb		Cd18	50	32							18
Sn40Pb42Cd18	145	Cd,Pb		Low melting temperature allows repairing pewter and zinc objects, including die-cast toys.	40	42							18
Zn70Sn30	199/376	–	no	For soldering aluminium. Excellent wetting. Good strength.	30							70
Zn60Sn40	199/341	–	no	For soldering aluminium. Good wetting.	40							60
Zn95Sn5	382	–	yes?	For soldering aluminium. Excellent wetting.	5							95
Sn90Au10	217	–	yes		90									10
Au80Sn20	280	–	yes	Au80. Good wetting, high strength, low creep, high corrosion resistance, high thermal conductivity, high surface tension, zero wetting angle. Suitable for step soldering. The original flux-less alloy, does not need flux. Used for die attachment and attachment of metal lids to semiconductor packages, e.g. kovar lids to ceramic chip carriers. Coefficient of expansion matching many common materials. Due to zero wetting angle requires pressure to form a void-free joint. Alloy of choice for joining gold-plated and gold-alloy plated surfaces. As some gold dissolves from the surfaces during soldering and moves the composition to non-eutectic state (1% increase of Au content can increase melting point by 30 °C), subsequent desoldering requires higher temperature. Forms a mixture of two brittle intermetallic phases, AuSn and Au5Sn. Brittle. Proper wetting achieved usually by using nickel surfaces with gold layer on top on both sides of the joint. Comprehensively tested through military standard environmental conditioning. Good long-term electrical performance, history of reliability. Low vapor pressure, suitable for vacuum work. Generally used in applications that require a melting temperature over 150°C. Good ductility. Also classified as a braze.	20									80
Au98Si2	370/800	–		Au98. A non-eutectic alloy used for die attachment of silicon dies. Ultrasonic assistance is needed to scrub the chip surface so a eutectic (3.1% Si) is reached at reflow.										98	Si2
Au96.8Si3.2	370 363	–	yes	Au97. AuSi3.2 is a eutectic with melting point of 363 °C. AuSi forms a meniscus at the edge of the chip, unlike AuSn, as AuSi reacts with the chip surface. Forms a composite material structure of submicron silicon plates in soft gold matrix. Tough, slow crack propagation.										96.8	Si3.2
Au87.5Ge12.5	361 356	–	yes	Au88. Used for die attachment of some chips. The high temperature may be detrimental to the chips and limits reworkability.										87.5	Ge12.5
Au82In18	451/485	–	no	Au82. High-temperature, extremely hard, very stiff.							18			82
In100	157	–	pure	In99. Used for die attachment of some chips. More suitable for soldering gold, dissolution rate of gold is 17 times slower than in tin-based solders and up to 20% of gold can be tolerated without significant embrittlement. Good performance at cryogenic temperatures. Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron.							99.99

इन्हें भी देखें

• टाँका लगाना